Used SANSHIN SPG-1200CNC #9187666 for sale

Name: SANSHIN SPG-1200CNC
Brand: SANSHIN
SKU: 9187666
Availability: InStock

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Wafer Grinding, Lapping & Polishing

Manufacturer

SANSHIN

Model

SPG-1200CNC

ID: 9187666

Vintage: 2011

CNC Rotary grinding machine Grindstone vertical stroke: 420 mm Max.working height: 400 mm Magnet chuck table diameter: 1220 mm Workpiece swing diameter: 1300 mm Diamond wheel diameter: 650 mm Table speed: 2 - 25 rpm Wheel spindle rotation speed: 255 - 7630 rpm With inverter Peripheral speed: 8.7 - 26 m/s Wheel spindle elevation: Forward speed: 200 mm/min Motor: 37 kW For rotating the spindle shaft With inverter Table rotation 2.2 kW (ES Motor) Wheel spindle axis forward / Forward feeding: 200 V 500 W (AC Servomotor) Coolant pump: 400 W With oilmatic for cooling grinding fluid 2011 vintage.

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SANSHIN SPG-1200CNC is a high-performance wafer grinding, lapping, and polishing equipment specifically designed for the precise and efficient processing of semiconductor wafers. The system provides superior processing, combining diamond abrasives with abrasive pads, to deliver high-accuracy results on a wide range of materials. The versatility also allows for multi-stage processing of a single wafer. SPG-1200CNC unit is used to accurately sharpen pre-cut wafers. It is able to handle thin and thick wafers alike. The spindle, grinding wheel and abrasive pads are all controlled by the advanced CNC machine. The grinding wheels can be programmed to operate at a set speed with a set pressure, providing precise control during the grinding operation. The tool features a sophisticated chip guard, removable rinsing tank, and a CCD (charge-coupled device) camera for inspecting the final result. SANSHIN SPG-1200CNC offers excellent precision and produces consistent results with minimal setup times. The asset also has multiple grinding parameters that can be easily adjusted to accommodate various wafer sizes. The model can also be operated in multiple modes, including coarse grinding, fine grinding, semi-finishing grinding, and polishing. The results can be fine tuned by adjusting parameters such as the grinding wheel speed, the pressure from the grinding wheel, as well as the number of grinding passes. All of these adjustments help ensure that the results achieved are to the desired specifications. Additionally, the equipment has an intuitive user interface which allows for setup and control of the grinding process with minimal effort. Overall, SPG-1200CNC is an excellent choice for those requiring precise grinding and finishing of semiconductor wafers. With its advanced CNC system, easy-to-use user interface, and superior grinding results, this unit is ideal for a wide range of applications. Additionally, its closed-loop machine maintains its accuracy and consistently provides excellent results.