Used SANSHIN SPG-600 #9216414 for sale

SANSHIN SPG-600 wafer grinding, lapping & polishing equipment is a state-of-the-art system designed for the grinding, lapping, and polishing of semiconductor wafers. The unit supports a wide range of wafer sizes, thicknesses, and diamond abrasives allowing for finer control over machining processes. SPG-600 is highly automated, featuring an integrated SUBAFS robotic arm for precise handling of wafers during processing. The dual-spindle design allows for grinding and polishing on both ends of the wafer simultaneously, while the high efficiency closed loop control machine ensures accurate control of material removal rate. SANSHIN SPG-600 features a closed-loop control tool which precisely controls every aspect of the grinding process. This enables precise control over both the removal rate of diamond abrasives and the overall roughness of the ground surface. The closed loop feedback asset also automatically adjusts the grinding parameters to maximize process efficiency and reduce processing time. SPG-600 also has a "wet" grinding capability, which utilizes a specialized liquid coolant solution to reduce friction and heat during the grinding process. This helps to reduce the time required to complete a grinding operation, as well as reducing the wear on both the diamond abrasives and the wafer surface. SANSHIN SPG-600 also features a low-vibration, ultra-quiet grinding chamber, allowing for near silent operation of the model. The low-vibration environment also helps to reduce the potential for microfracturing of the wafer during the grinding process. Overall, SPG-600 is an advanced, automated grinding, lapping, and polishing equipment designed for precise machining of semiconductor wafers. The integrated SUBAFS robotic arm and closed-loop control system ensure precise control over the machining process, while the wet grinding and low-vibration grinding chamber help to reduce wear on the diamond abrasives and maximise process efficiency.