Used SCHMID ONS 770 #97519 for sale

SCHMID ONS 770 is an innovative wafer grinding, lapping and polishing equipment designed to provide cost-effective, high throughput solutions with a short recovery time. The fully automated system features a powerful motor, with computer-controlled diamond lapping discs, and high precision grinding crystals. With a wide range of available lane sizes, this unit is capable of processing thin and thick substrates, up to 152mm in diameter. ONS 770 is engineered to provide repeatable and accurate results every time. It features a digitally controlled wafer grinding surface with fully adjustable parameters and independently adjustable diamond grinding wheels. This maintains a consistent and uniform grinding depth on all edges of the wafer. With the use of a rotary indexer, the machine can adjust the grinding angle and can also correct any groove profile errors in the material. The tool also mechanically aligns the substrate to the uniform grinding surface. In addition, SCHMID ONS 770 utilizes a vacuum chuck to secure the wafer and a sprinkling asset which evenly distributes polishing jet solution over the wafer's surface. It is also equipped with a centrifugal pressure separator for further cleaning of polishing jet solution and a filter for the polishing jet. This ensures an efficient lapping and polishing process with a maximum polishing effect. The fully automated facility offers user-friendly operation and can be quickly set up, feature a highly intuitive operating interface, and several different programs are available to suit the specific needs of each process. It is equipped with a communications interface for upload of chip data, measurement results and project reports. It is configured to maintain a fully automated cleanroom environment and has several pollution prevention measures to ensure upmost efficiency and reliability. ONS 770 is able to provide reliable, cost-effective and high throughput results for a variety of substrates, ranging from LCD and displays to medical implants and collector plates. Its automation ensures the highest possible productivity, minimizing manual labor and human errors. The model provides a combination of high quality and flexibility for a wide range of wafer grinding, lapping and polishing applications. With its advanced technology, it is the perfect solution for high-volume and high-precision wafer processing needs.