Used SCHNEEBERGER 3SMG-Sirius #170035 for sale
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ID: 170035
Vintage: 1992
Grinding machine
Specifications:
Control: GE Fanuc 15M
Spindel RPM: 3000 RPM
X: 400mm
Y: 200mm
Z: 310mm
1992 vintage.
SCHNEEBERGER 3SMG-Sirius is a highly precise equipment for wafer grinding, lapping and polishing. This system can be integrated with a variety of different tools and accessories to meet a wide range of requirements. The unit is capable of intensive grinding and lapping, as well as ultra-precise polishing to achieve flawless surfaces. 3SMG-Sirius utilizes innovative components to guarantee the precision and accuracy of the wafer materials. This includes a PLC control unit, as well as an LCD touch screen for easy operator access to the machine. The drive and transmission systems are constructed from SCHNEEBERGER patented Servo Drive systems, allowing for precise and reliable operation. SCHNEEBERGER 3SMG-Sirius uses a dual-spindle design for the grinding, lapping and polishing process. This is designed to allow for maximum throughput and accuracy. The dual spindles are powered independently so that the speed and pressure of the process can be adjusted for precise control. The machine is equipped with a range of grinding, lapping and polishing accessories, including diamond-coated grinding wheels, brush wheels, adhesive-tape- backed sandpaper, and emulsion filters, depending on the desired surface texture. The abrasives used in the wafer grinding, lapping and polishing process are chosen to produce the desired surface quality and finish. For instance, diamond-coated grinding wheels, with their high hardness, can be used to grind down sharp edges and prepare surfaces for polishing. Similarly, brush wheels are the preferred choice for removing large material defects or surface damage. 3SMG-Sirius is designed to process many different materials, including ceramics, tungsten carbide, crystalline glass, as well as ultra-hard materials and optical glasses. The tool is equipped with vacuum chucks for a reliable hold on the wafer and ensures that the grinding, lapping and polishing is performed parallel to the wafer. This enables the asset to process wafers of almost any size and shape, including very thin and fragile specimens. SCHNEEBERGER 3SMG-Sirius offers many safety features, including an emergency-stop button, an integrated coolant model, and an umbrella-style enclosure. This prevents sparks from flying and reduces the risk of injuries. 3SMG-Sirius is an innovative and precise equipment for wafer grinding, lapping and polishing that enables high-quality results with the utmost accuracy and precision. It is designed to process a range of materials, offering flexibility for any application.
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