Used SCHNEEBERGER Sirius SMG #9066971 for sale
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ID: 9066971
Vintage: 1994
Grinding machine
Max. grinding diameter 200 mm
Grinding length 200 mm
Workpiece length mm
Control FANUC
1994 vintage.
SCHNEEBERGER Sirius SMG is an advanced wafer grinding, lapping, and polishing equipment that offers a complete, precision machining solution for a variety of wafer processing applications. Based on a compact, modular design, the system boasts a range of capabilities including high-precision in-line grinding, lapping, and polishing of both individual and multiple-sized wafers with the utmost accuracy. It features a range of 32-bit architectures such as Index Servo Control (ISC) which provides precise force control over various process parameters, and an integrated dual-axis inclined spindle that ensures even and proper grinding results. Additionally, the unit houses a number of specialized features including a variable finesse lapping head, an integrated optical protection machine, and a high-precision CleanTEC vacuum deburring station. The tool is equipped with a powerful and reliable servo drive asset which is able to process wafers up to 100 mm in diameter and thicknesses ranging from 0.2 to 3.2 mm. Its lapping head is also capable of providing a range of processing capabilities. The model can perform single-step grinding and lapping operations, dynamic oscillation technology for motion smoothening, and can achieve cutting speeds up to 2000 rpm for optimal process effectiveness. A central control panel allows users to quickly access vital equipment information while an option-rich, easy-to-use control interface enables straightforward navigation and automated process programming, as well as manual adjustments for custom profile settings. The system is also designed to save time and minimize operator fatigue with its wide range of special features and easy-to-use settings. It includes a built-in auto-feed feature which allows it to process multiple wafer types sequentially, and PC-compatible software that allows users to monitor and control the unit with graphical visualizations of the machining process. It is further complemented by optional features such as an automated filtration machine which ensures a cleaner working environment by collecting dirty residues or particles, and an auto-positioning tool to ensure precise and accurate loading of the wafers. Overall, Sirius SMG asset offers an unbeatable combination of flexibility, performance, and affordability. Its powerful hardware, innovative and intuitive software, and wide range of features make it an ideal choice for advanced wafer grinding, lapping, and polishing applications.
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