Used SCHNEIDER CB Bond 09 E #293831245 for sale

SCHNEIDER CB Bond 09 E is a wafer grinding, lapping and polishing equipment for ultra-precision single-side and double-side processing of semiconductor wafers up to 200mm in diameter. It is designed with an innovative metal bond technology, which provides highly accurate grinding, lapping and polishing results. This technology enables the highest precision in planarity and dimensional accuracy to be achieved. CB Bond 09 E system is capable of grinding, lapping and polishing a wide range of materials including standard silicon, gallium arsenide, and other III-V semiconductor materials. It is a fully automated machine that provides accurate repeatability with a cycle time of less than 10 minutes per wafer. The grinding, lapping, and polishing process functions in a closed loop during the entire process, allowing for superior control and precision. SCHNEIDER CB Bond 09 E is equipped with a high-precision tool spindle , a powerful inverter-driven direct motor and a ceramic-metal bond diamond grit grinding wheel. This wheel is designed to achieve a superior surface finish with minimal subsurface damage. The grinding wheel is driven by a powerful digital motor which powers the cutting resistance and speed across the entire range of work pieces, controlling the rate of material removal. The advanced grinding, lapping and polishing station has adjustable digital timers which allow for precision machining to highly accurate tolerances. The timers are also capable of displaying various parameters, such as cycle time and total process time. This powerful feature allows for superior control of abrasive removal, ensuring the highest precision and quality. The unit is completed with a built-in air purge machine, a water-cooled EM coil, a high-precision vacuum module, and a user-friendly operating tool. This operating asset allows for customized setup and control of larger production runs and supports the use of automated shopfloor patterns. CB Bond 09 E is an innovative solution for ultra-precision single-side and double-side machining, offering superior performance and unsurpassed results. It is the ideal solution for extremely demanding operations, providing the highest precision and accuracy in grinding, lapping and polishing operations.