Used SCHNEIDER CB Bond 09 #9248183 for sale

SCHNEIDER CB Bond 09 is a powerful and precise wafer grinding, lapping, and polishing equipment designed to provide the highest level of process control and accuracy for wafer-level applications. This automated system is equipped with a four-axis positioning unit, and is coupled to a powerful SCHNEIDER-developed and constructed concentrated diamond suspension, allowing unparalleled adjustment capability for fine-grained lapping and polishing. The core automation components of the machine include an electronic control panel, which provides intuitive graphical user interfaces that enable the operator to select different process parameters, including speed, pressure, and abrasive quality. Additionally, a dynamically responsive automated process controller (APC) provides real-time monitoring of the processing conditions, allowing for highly accurate and consistent results - even when processing a large batch of wafers. CB Bond 09's integrated machine design allows for high-fidelity, low-cost wafer grinding operations through an array of advanced cyclical processes, including grinding, roughing, and polishing. The grinding tool can utilize different grinding disks, which are designed to enable efficient and precise grinding operations. The roughing process includes a series of cross-hatch and band patterns, as well as spiral and mirror patterns, for achieving the desired surface roughness. The polishing portion of the process is completed using a series of lapping patterns which allow for the precision control of the end product. Along with its ability to provide the desired precision and uniformity across the entire wafer surface, SCHNEIDER CB Bond 09 is also equipped with a unique non-contact, wafer-handling module, which allows for the automated exchange of wafers during the grinding and polishing processes, providing for uninterrupted processing of a large batch of wafers. In conclusion, CB Bond 09 is an accurate and versatile wafer grinding, lapping, and polishing asset, which provides an extremely cost-effective solution for advanced wafer-level manufacturing operations. With its intuitive graphical user interface, powerful automated process controller, and its full suite of advanced cyclical processes, SCHNEIDER CB Bond 09 can be utilized to create highly accurate, precise, and consistent wafer-level components.