Used SCHNEIDER CCP 102 #293798624 for sale

SCHNEIDER CCP 102 is a top-of-the-range wafer grinding, lapping and polishing machine equipment that sets a new benchmark in precision and productivity. It is a fully automated, high throughput system designed to handle a wide variety of wafer grinding, lapping and polishing requirements, from very large-diameter wafers down to as small as 150mm diameter. With its highly efficient, extremely accurate and precise biaxial drive unit, CCP 102 can efficiently and precisely process and finish a wide range of wafer components by grinding, lapping and polishing them to perfection. SCHNEIDER CCP 102 is designed make use of advanced computer control systems to precisely coordinate the actions of its many complex components. Each component of the machine is fully automated, which enables it to be used for both single and multiple-step grinding, lapping and polishing. Using the tool's intuitive touchscreen user interface, the asset can be easily and quickly programmed for different sized wafers, different grinding/lapping/polishing techniques, and even adjustable grindstone positions. The machine uses a biaxial drive model of ultra-precision grinding/lapping/polishing heads for advanced biaxial movement to maximize throughput and to ensure complete accuracy and uniformity of the components. The heads are located above a wafer cassette that feeds the grinding stones, lapping wheels and polishing laps automatically and efficiently to the wafers. CCP 102 features an onboard process monitoring equipment, ensuring that the users are alerted to any process deviation and can take corrective measures. SCHNEIDER CCP 102 also includes multiple safety features, from e-stop buttons and dynamical safety guards to an arm range gate that prevents fingers or other foreign bodies from entering the grinding area and being injured or damaged by its high speed grinding wheels. To sum up, CCP 102 is a high precision, high throughput wafer grinding, lapping and polishing system designed to efficiently and accurately process and finish a wide variety of wafer components. Its intuitive user interface combined with advanced computer control systems, multiple safety features and high speed, precise biaxial drive unit enable it to provide superior quality and repeatability, while maximizing productivity and minimizing downtime.