Used SCHNEIDER CCP 102 #293798628 for sale

SCHNEIDER CCP 102 is a wafer grinding, lapping, and polishing equipment that has been designed to meet the modern needs of the semiconductor industry. Utilizing a unique design and advanced grinding technologies, the system allows users to achieve the highest surface quality within a short period of time. The unit is equipped with a high-force linear motor grinding spindle that is capable of producing forces greater than 4 kN, with extremely low vibration and acoustic noise levels. This allows for efficient and cycle times with a high depth of accuracy. A modern machine controller based on the most up-to-date programmable logic controllers (PLC) is incorporated, providing for a simple and consistent process on multi-level substrates. CCP 102 has been designed for compatibility with a wide variety of wafer materials with maximum load capacities up to 7.5kg. It is equipped with an eccentricity adjustment tool that is highly precise, allowing for accuracy up to 30 µm. The machine is also designed to be able to be programmed for wafer sizes from 50mm to 500mm, with a wide variety of grinding and polishing parameters. The lapping and polishing station on SCHNEIDER CCP 102 is equipped with the most advanced abrasives' technology on the market, allowing for quick and precise polishing results. This asset is able to produce uniform polishing surfaces on the wafer's front and back sides in a single pass. The integrated non-contact wafer thickness monitoring model of CCP 102 is able to measure thicknesses with an accuracy of better than 1nm. Due to the integrated cooling unit controlling the wafer's temperature and humidity levels, the equipment ensures thermal tracing of high precision in dynamic grinding and lapping, as well as temperature monitoring throughout the process. The integrated maintenance features of SCHNEIDER CCP 102 ensure a trouble-free machine operation. Its cleanroom class H14 function, auto-diagnostics, and cleaning features lower the amount of maintenance needed; making it a perfect choice for the modern industrial needs. CCP 102 is a perfect choice for achieving the highest standards of accuracy in wafer grinding, lapping, and polishing. Offering a unique design coupled with advanced grinding technologies, the system offers great performance and repeatability for the highest quality polished wafers in the industry.