Used SCHNEIDER CCP 102 #9284165 for sale

SCHNEIDER CCP 102 Wafer Grinding, Lapping & Polishing Equipment is an optically contoured semi-automatic system designed for fast and precise grinding, lapping, and polishing of various semiconductor materials up to 6 inches in diameter. The unit utilizes a single 200mm lap plate, enabling either one or two workpiece surfaces to be worked simultaneously. The machine is supported by a compact and rigid machine frame bench with low-contact-point footprint. It features a steady, smooth-running stepper motor drive with excellent low-vibration characteristics that maintains consistent grinding pressure over long time intervals. The tool includes a coolant interface, allowing for the use of standard water-based coolant for improved sample protection. It also comes with programmable software that enables users to easily set and control the various asset cutting parameters such as spindle speed, cutting pressure, grinding action and cooling rate. An automatic compensation model allows for adjustment of the parameter settings according to user specifications. The pre-lapping, grinding, and polishing motors are equipped with a patented vacuum equipment, water-jet nozzle, and lapping plate. These components are all designed to help reduce the grinding time, decrease damage potential, and increase process efficiency. The system includes an integrated vacuum unit and water-jet nozzle to further reduce sample slippage and contamination, as well as improve the surface quality of the wafer. CCP 102 Machine also has several optional accessories, including a variable-angle epoxy chuck, movable chuck, and a double-side lapping plate. SCHNEIDER CCP 102 Wafer Grinding, Lapping & Polishing Tool is an ideal solution for users who require a versatile, reliable, and high-performance machine for working semiconductor materials. It is easy to install and requires minimal maintenance, so users can get up and running quickly. Its compact design and low profile make it easy to store and transport. Many industry-leading wafer grinding and polishing companies, such as Intel and Foxconn, have chosen CCP 102 Asset to help perform rapid and high-quality substrate production.