Used SCHNEIDER CCP 102 #9295055 for sale

SCHNEIDER CCP 102 is an advanced wafer grinding, lapping and polishing equipment. It has been specifically designed for the aggressive production of high-volume ultra-smooth wafers in microelectronic and photonic components. CCP 102 enables thin wafers to be ground, lapped and polished quickly and accurately in a single process step.System components include a rigid aluminum support precision ground to ensure optimal performance. SCHNEIDER CCP 102 control unit is the heart of the unit, featuring a microprocessor-based touchscreen interface for easy operation. The unit is capable of managing 1000 operating parameters, including the feed rate, force settings and dwell times to ensure optimal results. It also features a user-friendly graphical front-end that displays step-by-step workflows and various process settings. The machine also features integral lighting and a digital camera with advanced imaging capabilities for real-time wafer inspection. This allows the operator to monitor the grinding, lapping and polishing process both visually and through an advanced optical video camera. CCP 102 is designed to accommodate the grinding and polishing of a wide range of materials such as silica, alumina, quartz and ceramics. This tool is further enhanced by a unique grinding and polishing configuration. This feature allows the operator to customize the asset to accommodate the different needs of various materials. This advanced model also features a digital equipment recalibration to maintain consistency and accuracy throughout the operation cycle. SCHNEIDER CCP 102 features three independent input/output positioning data acquisition systems and changeable lapping and polishing tools for maximum precision. In addition, the system is equipped with a wafer handling cell that is completely enclosed to minimize contamination and ensure accuracy. Overall, CCP 102 wafer grinding, lapping and polishing unit is an advanced, high-performance machine designed to satisfy the requirements of the most demanding applications. Its precise digital control, integrated imaging tool, and unique grinding/polishing configuration make it a powerful and accurate choice for efficient and cost-effective wafer production.