Used SCHNEIDER CCP 103 #293618291 for sale

SCHNEIDER CCP 103 Wafer Grinding, Lapping & Polishing Equipment is a fully-automated machine for producing ultra-flat, ultra-smooth surfaces on various types of wafers. It is designed for controlled, precise grinding and lapping/polishing operations for submicron level dielectric surface requirements. CCP 103 system consists of a single, coordinated stand-alone unit containing a rotating spindle head, motor, motor control unit, feed servo and feed clamp. The spindle head holds the grinding disc, which rotates at up to 50,000 RPM to grind and lap the wafer surface. The motor control unit controls both the rotation of the spindle head and the feed servo, which keeps the grinding wheel in contact with the wafer. The feed clamp holds the wafer in place during the grinding and lapping/polishing process. The unit uses sophisticated computer-controlled algorithms to maintain consistent control of spindle, motor and feed rates during the grinding and lapping/polishing process. This ensures precise control of the process by optimizing and adjusting the grinding process, maximizing productive yield and creating extremely precise, precise surfaces on the finished wafer. The resulting surfaces are flat and smooth, with minimal surface roughness. The machine is also designed for easy cleaning and maintenance. The entire unit can be quickly disassembled and the parts reassembled for quick, efficient cleaning. The feed clamp is easily accessed for convenient cleaning and the mold can be removed and replaced if necessary. SCHNEIDER CCP 103 Wafer Grinding, Lapping & Polishing Tool is a highly-precise, reliable machine for producing ultra-flat and ultra-smooth surfaces on various types of wafers. It is perfect for controlled, precise grinding and lapping/polishing operations for Sub-Micron dielectric surface requirement applications. The asset offers easy disassembly and cleaning, and precise control of the grinding and lapping/polishing process.