Used SCHNEIDER CCP 103 #293624592 for sale

SCHNEIDER CCP 103 is a wafer grinding, lapping & polishing equipment designed for grinding, lapping, and polishing wafers both manually and automatically. This fully automated system features a computer-controlled CNC unit with an integrated touch screen user interface for intuitive manipulation of deep wafer grinding and polishing steps. CCP 103 also features a fast and accurate substrate positioning machine and an advanced software based on innovative path-planning algorithm. It is capable of handling a wide range of wafer sizes and shapes with ease. SCHNEIDER CCP 103 offers excellent process stability and the highest quality grinding results. The tool includes a precision grinding spindle, which enables precise grinding and lapping of silicon, Insulator, Gallium Arsenide, Quartz, Alumina, and other hard materials. Furthermore, the grinding spindle is capable of speeds ranging from 50 to 400 rpm allowing the user to customize the grinding process for specific wafer materials. The CNC asset of this outstanding grinding model consists of three-axis motion control, linear measuring systems, and high speed servomotors. This allows for highly accurate grinding, lapping and polishing without the need for constant operator supervision. CCP 103 includes a fully automated lapping and polishing workstation. This workstation guarantees best possible polishing results thanks to its superior control of polished surface quality. It is equipped with a computerized software control, allowing the user to easily control the parameters of the process and monitor it in real-time. The equipment also includes high-quality lapping and polishing components such as a dipper, lapping plate and polishing pad, which enables quick and efficient lapping and polishing of a variety of wafers. SCHNEIDER CCP 103 ensures superior grinding and polishing results thanks to its extended range of accessories including an automatic substrate clamp system, an optional multi-axis load/unload unit and an optional automatic carrier plate cleaning machine. Additionally, the tool is equipped with powerful grinding software: WaferGrind. This advanced software is designed to optimize the process from grinding path planning to substrate handling, allowing for full control and flexibility of the entire grinding, lapping, and polishing process. CCP 103 is a reliable wafer grinding, lapping & polishing asset that provides users with superior performance and the highest quality results. This fully automated model ensures efficient and accurate control over the entire process, while delivering superior results and high yield rates.