Used SCHNEIDER CCP 103 #9287234 for sale

SCHNEIDER CCP 103 wafer grinding, lapping & polishing equipment is designed for the production of extremely thin and uniform wafers for applications such as optical devices, mems, capacitors, and leds. This system offers a variety of features including full automatic operation and simultaneous grinding, polishing and lapping. CCP 103 has a three-axis grinding and lapping spindle, making it suitable for larger substrates than traditional manual polishing machines. The automated unit can handle substrates up to 300 mm in diameter and 5 mm thick, allowing for fast and accurate production of thin films. SCHNEIDER CCP 103 features a wide range of process control parameters that can be adjusted to produce the desired wafer surface finish. This includes parameters such as grinding wheel speed, surface grinding pressure, rotational feed speed, and lapping pressure. The adjustable process parameters provide an optimal range of grinding, lapping and polishing results. The integrated touch screen interface makes the operation of the machine easy and the machine offers multiple process modes for diverse applications like grinding-polishing, lapping-polishing and multilayer lapping. The tool is equipped with diamond grinding wheels and high-precision lapping films that can produce high surface quality and flatness with minimal deformation. Furthermore, it is designed to provide repeatable results through a combination of automated loading and unloading, as well as automatic process monitoring. The asset also features a vacuum model to ensure optimal wafer handling and surfaces retaining at low cost. CCP 103 is designed to integrate into a production line while providing the highest level of quality and accuracy. It is suitable for a variety of production processes, making it ideal for high-volume production. It can also be used in in-house production applications, such as prototyping, and research and development. SCHNEIDER CCP 103 wafer grinding, lapping & polishing equipment is a powerful, reliable and highly precise tool for wafer production, providing accurate and repeatable results.