Used SCHNEIDER CCP Modulo #293629462 for sale

SCHNEIDER CCP Modulo is a state-of-the-art wafer grinding, lapping and polishing equipment designed to process both non-planar and planar wafers with maximum efficiency and control. This system features a unique modular construction which allows for flexibility and easy scalability. This allows users to customize the machine to fit their particular needs. The machine comes standard with a 20" diameter grinding wheel, adjustable speed for most applications, and a variety of lapping and polishing plates for better precision and accuracy. The heavier-duty lapping and polishing plates feature a diamond-like carbon coating on the wafer surface for increased durability and strength. Additionally, the machine is designed with integrated process control and sensors to monitor the process progression and to adjust the process accordingly. CCP Modulo Unit is also designed for safe operation and minimal user interface. Its automatically-controlled process parameters and its integrated control console provide for easy maintenance and operation. Other features include a digital display of parameters, fine-tune settings, and an emergency shut-off switch. The productivity of SCHNEIDER CCP Modulo Machine is further increased by its high accuracy and productivity. This tool provides repeatable, low-tolerance results with each run, as well as automation and a fast cycle time. This high level of accuracy is achieved by the low-center-of-gravity design, as well as its large grinding and polishing platens that are easily moved and configured as necessary. In conclusion, CCP Modulo is a powerful and efficient wafer grinding lapping and polishing asset that provides users with intricate details and tight tolerances. Its high-accuracy and repeatable results, high productivity, and integration of sensors and process control make it an excellent choice for most manufacturing applications.