Used SCHNEIDER CCP Modulo #293639804 for sale

SCHNEIDER CCP Modulo is a high-performance equipment for wafer grinding, lapping, and polishing. It is suitable for both terminal and intermediate grinding of semiconductor wafers, providing users with a reliable performance and accuracy. The device is based on SCHNEIDER ElectricCCP Modulo concept, with specific designs for particular applications. The modularity of the system ensures easy access to every component and ensures easy and efficient maintenance. The unit uses low pressure and repeatable rotation elements, providing a stable and reliable performance. The main features of the device include grinding, back lapping, and polishing. During grinding, the rotating disk supports the pressure of the disk and stabilizes the cutting dynamics and uniformity of the runout. The back-lapping process removes any residual flatness discrepancies left over from the grinding process. The polishing stage is done by the PHOTONIS Saphir, a specialized tool for polishing extremely thin wafers down to 6 µm or less. SCHNEIDER CCP Modulo is equipped with an advanced electronic interface as well as a wide range of safety features. The machine is designed to protect wafers from any type of damage during processing and also provides an enhanced control on di-electric and chemical control. The advanced interface allows users to easily program and manage operations. The tool also includes a number of adjustable parameters such as speed, pressure and timer. CCP Modulo is a reliable device for any semiconductor wafer processing. Its modular design provides an efficient maintenance process and its advanced features ensure optimal performance and accuracy. This device is one of the most trusted choices when it comes to wafer grinding, lapping, and polishing needs.