Used SCHNEIDER CCP Nano 2 #293645058 for sale

SCHNEIDER CCP Nano 2 is a wafer grinding, lapping & polishing equipment designed for precision surface treatments. The system is designed for cleanroom applications with temperatures ranging from -10°C to 40°C and humidity ranging from 20-80 %RH. It features a fully-enclosed heated working chamber with cleanroom-class stainless steel surfaces and internal lighting. The unit is equipped with a high-precision direct drive motor with adjustable speed and adjustable working pressure. The grinding, lapping & polishing process is carried out with precision by a controlled abrasive media motion. The special work process is divided into three overlapping grinding, lapping & polishing cycles comprising of coarser, intermediate, and fine polishing. The grinding cycle is designed to allow for very uniform removal of material with minimal edge damage. Additionally, the lapping cycle takes advantage of a special abrasive media process to obtain an extremely flat surface. Finally, the finishing cycle creates a mirror-like surface with a very high level of optical smoothness. The machine features a graphical user interface (GUI) with easy-to-use Macros which allow for quick and easy set-up of the tool, as well as advanced features like cycle parameters and runtime control. The control asset allows for precise control of pressure, cycle times, and other parameters during each cycle. The model incorporates a "Safe" chip spinnin mode which allows for extra safety while changing the wafer carrier. The equipment also has external connections for vacuum systems, compressed air and cooling gas, which allows for external monitoring and control of the process. CCP Nano 2 is designed for fully automated operation with a reliable and easy-to-use software application. The integrated microprocessor-controlled process valve system ensures precise control of all cycle parameters. Additionally, the auto-calibration of the polishing pressure and feed pressure is applied automatically during the start-up process. Overall, SCHNEIDER CCP Nano 2 is an advanced unit designed for precision surface treatments. The machine is designed for precise and repeatable processes, high level of automation and operator safety. The integrated features and parameters ensure precise control of the grinding, lapping & polishing process and it is suitable for cleanroom applications.