Used SCHNEIDER CCP Nano #293779042 for sale

SCHNEIDER CCP Nano is a wafer grinding, lapping, and polishing equipment that is designed to produce ultra-high quality thin wafers. This system is ideal for use in semiconductor applications where high levels of surface finish are required. It is capable of grinding and polishing wafers with micron range accuracy. This unit is equipped with a SCHNEIDER SCA-5 automatic robotic wafer handling machine, providing its full automation capability. The SCA-5 robot uses high torque servo motors for motorized wafer handling, and its movement is able to reach far corners accurately. It allows for multiple wafer sets to be processed in series or in parallel. The POLIPLAT Grinding & Lapping Tool provides automated precision grinding and lapping. It can handle a wide range of thin wafers, up to a diameter of 200mm and thickness of 1mm. The POLIPLAT asset has a unique "open architecture" concept for user-defined processes and wafer characteristics. The final stages of the process are accomplished utilizing the Brite polisher. Its cylindrical polishing technology yields consistent results regardless of wafer size and shape. It features a built in abrasive-feed model, capable of delivering exact slurry for optimal polishing. CCP Nano is a fully automated and highly efficient equipment. Its open architecture allows for a user-defined custom process, allowing for flexibility and ease of use. Its fully automated robotic wafer handling system ensures that wafers can be handled with high accuracy in a fast and efficient manner. Furthermore, the grinding and lapping processes are handled precisely by the POLIPLAT Unit. Finally, the polishing process is highly efficient thanks to the Brite polisher. Overall, this machine produces thin wafers of the highest quality and is ideal for semiconductor applications.