Used SCHNEIDER CCP O-Max #9005302 for sale

SCHNEIDER CCP O-Max is a wafer grinding, lapping and polishing equipment designed for precision polishing and grinding of high-performance semiconductor materials such as silicon and sapphire. It is an advanced system that offers superior capabilities to other systems on the market with respect to wafer flatness, scratch-free profile, and roughness. The unit is suitable for a variety of wafer diameters from single wafers up to 12''. It provides a three-axis, automatic, dual-head, wafer centering solution and a four-axis CNC machine for both grinding and polishing. The tool includes two carriers that offer precise and uniform motion, resulting in high-quality, wafer lapping and polishing. CCP O-Max can be configured on either a wet or dry basis, with the wet process providing better removal rates and the dry process providing better surface qualities. The asset is equipped with a unique air bearing spindle, provided with a proprietary profile that allows for finer and faster grinding and polishing. The model utilizes a powerful vacuum equipment and sophisticated cooling system, ensuring that the wafer's characteristics are not damaged during the grinding and polishing process. The unit is also designed for the production of high near-net grade wafers, with pattern defect counts below two parts per million and surface roughnesses below 1 nm Ra. Additionally, it can process high-aspect-ratio wafers, and is capable of accommodating complex geometries and topographies. Overall, SCHNEIDER CCP O-Max is an advanced machine specifically designed for the precision grinding and polishing of high-performance semiconductor materials. It offers superior capabilities compared to other systems on the market, providing an efficient and accurate process for producing high-grade and highly intricate wafers.