Used SCHNEIDER CCP Swift #293618684 for sale

SCHNEIDER CCP Swift is a world-class wafer grinding, lapping, and polishing system designed for the demanding requirements of the semiconductor industry. It features the newest SCHNEIDER CLT direct-drive, multi-axis, highly-precise grinding spindle to achieve very high accuracies for wafer flatness, roundness, and parallelism. The spindle offers adjustable speeds of up to 15,000 RPM and a torque of up to 32 Nm, providing exceptional performance and flexibility to meet ever-changing production requirements. The Swift is designed to minimize downtime with its simple, easy to use, user-friendly controls and user-defined process configurations. The powerful, high-precision SCHNEIDER servo motors enable fast and repeatable process set-up and changes. In addition, all movements are programmable, allowing for flexibility to quickly adapt to varying wafer grinding, lapping, and polishing processes. The Swift also incorporates SCHNEIDER intelligent task scheduling software and automated interlocks. This ensures that tasks are completed in the most efficient order with minimal risk of process interruption. The system is also equipped with an advanced vision system and capable of performing inspections and measurements on the wafers, ensuring quality consistency. The Swift features a multi-function process chamber that allows for reliable performance and flexibility. This is backed up with a unique transmission design, which maintains optimal pressures for wafer lapping and polishing. The Swift also includes SCHNEIDER C-Arm which allows the user to monitor and adjust process parameters, eliminating manual adjustments to the chamber pressure and temperature. The entire Swift is designed to not only be productive and efficient, but also reliable and easy-to-use. CCP Swift offers unprecedented control over wafer processing, enabling wafer quality to be consistently kept at the highest standards. The high performance and cutting-edge technology that the Swift offers makes it the ideal choice for any semiconductor wafer grinding, lapping, and polishing requirements.