Used SCHNEIDER CCP Swift #9248210 for sale
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ID: 9248210
Vintage: 2012
Polisher
Polishing tank
With accessories
Chiller
2012 vintage.
SCHNEIDER CCP Swift is a technologically advanced wafer grinding, lapping and polishing equipment designed to deliver high-performance surface finish for highly engineered microelectronic components or substrates. This system offers unparalleled speed and accuracy for any grinding, lapping or polishing task, as well as unmatched versatility as it can be configured for any individualized requirement. At its core, CCP Swift utilizes a heavy duty frame with integrated spindle windows, an adjustable gap plate, and a rotational speed adjustment knob. This sturdy design allows for maximum process stability and a high degree of accuracy, while its wide work envelope provides for effective and efficient machining and polishing of all sizes of wafers. In addition, the adjustable gap plate can enable the tool to work at higher speeds with improved control. SCHNEIDER CCP Swift is equipped with several modules, including a grinding wheel, thin-film lapping plates, and a polishing fixture. The grinding wheel allows for effective grinding of intricate surface features on wafers, while the lapping plates offer precision cut surfaces, achieving a flat surface finish with superior quality. The polishing fixture complete the process by providing an even, attractive finish. In addition, CCP Swift is equipped with several other features that enable improved operational efficiency and superior surface finish. These features include powerful vacuum technology that minimizes the generation of airborne particulates, dust, and dirt; a highly advanced machining software optimizes machining speeds and feed rates; a touch-screen operator interface provides operators with an intuitive platform for system operation and feedback; and a robust casing design ensures system durability in harsh production environments. Overall, SCHNEIDER CCP Swift is a technically advanced engineering marvel with enhanced capabilities in wafer grinding, lapping and polishing applications. It serves to provide superior surface finish and control precision with a wide range of workspaces that can be customized as per individualized application requirements and operational efficiency.
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