Used SCHNEIDER CCP Swift #9362202 for sale

SCHNEIDER CCP Swift wafer grinding, lapping, and polishing equipment is a powerful and efficient tool for achieving precision polishing and grinding of wafers for a variety of semiconductor applications. This system is designed to meet high performance demands for the production of ultra-flat and uniform surfaces for wafer-level applications including CMP (Chemical Mechanical Planarization) processes. CCP Swift uses a high-velocity, high-pressure air circulation unit to create a low profile grind-lapping surface which is ideal for the quick and uniform lapping/polishing of wafer surfaces. SCHNEIDER CCP Swift features a high-precision air bearing spindle which operates with smoothness, precision, and stability for maximum performance. The air bearing spindle can be varied in speed, ranging from 0 to 550 RPM, enabling precise process control and efficient machining operations. CCP Swift is also equipped with a dynamic balancing machine which ensures smooth, vibration-free operation throughout the entire process, eliminating the need for manual vibration control and allowing both speedy and accurate grinding-lap-polishing operations. SCHNEIDER CCP Swift is capable of grinding, lapping, and polishing substrates of various sizes and thicknesses, including flat samples of up to 600mmX600mm. CCP Swift is also equipped with a unique integrated clean room, which prevents contamination of the substrate by avoiding the use of outside filters and air cleaners. This integrated clean room is equipped with HEPA filtration and gives the user an additional level of protection while ensuring a safe and clean working environment. SCHNEIDER CCP Swift is a versatile and precise machine that is user-friendly and reliable. It is easy to program and quickly adaptable for applications with a variety of different wafer sizes, ensuring convenience as well as efficiency for users. CCP Swift is an ideal tool to achieve the highest quality wafer substrates with the shortest possible process times.