Used SCHNEIDER GMA #293650029 for sale

SCHNEIDER GMA Wafer Grinding, Lapping & Polishing Equipment is a versatile, precisely engineered and built system for the purpose of efficiently and accurately finishing up to 10" and 12" diameter wafers in a high-volume, multi-shift environment. The unit is designed to handle wafers from 1-7mm thick, that can be lapped, softened, tapered, and ground to the extremely high precision specifications necessary for the most technical applications of today's semiconductor technology. Wafers are loaded vertically into a self-centering vacuum chuck, and the chuck securely holds the wafer during lapping, grinding, and polishing. The lapping process is intended to create an ultra-smooth surface on the wafer and to achieve high step heights. The grinding process is used to reduce the wafer's surface roughness, while maintaining its overall size. The grinding is completed with CNC servo feedback closed loop technology, to perfectly adjust and manage the amount of force applied to the grinding wheel in order to achieve the desired outcome. The polishing process is used to further refine the wafer's surface. This is accomplished through the use of diamond abrasive slurries with precise mechanical pressure. An air bearing spindle machine is used to achieve extremely smooth, precise and uniform polishing of the wafer's surface. The result is a wafer that is optically clear, with superior surface finish and uniformity. GMA tool is a highly reliable, cost-effective manufacturing solution that meets the demands of the most precise and demanding processing applications. The asset can be easily integrated into new or existing production lines, and can be configured to accommodate different types of wafers. With its high-precision repeatability and robust design, SCHNEIDER GMA model is an ideal choice for high volume and large lot production lines. The equipment is designed for quick setup and easy maintenance, and with its user-friendly touch-screen display, operation is intuitive and efficient.