Used SCHNEIDER SLG 120-S2/2 #9236776 for sale

SCHNEIDER SLG 120-S2/2 is a professional wafer grinding, lapping and polishing equipment designed for high precision and accuracy applications. It is able to process a wide variety of wafers, including silicon, germanium, GaAs, and optoelectronic components. With outstanding precision and stability, this system is ideal for high-end semiconductor fabrication processes. SCHNEIDER SLG 120-S2/2 consists of two vessel platforms, each consisting of two interconnected vessels, to provide both top and bottom processing. Each vessel platform is mounted on an additional platform with a stepper motor drive, allowing for fine control of processing speed. This unit uses an on-board programmable logic controller (PLC) to control all the machine functions, providing a high level of precision and consistent performance. The tool incorporates a precision grinding wheel and a polishing plate to process the wafers. The grinding wheel is made from an extremely hard, wear-resistant material and is capable of high cutting force and accuracy. The polishing plate is covered with a fine diamond-coated material, ensuring a high quality and uniform finish. For wafer grinding, the asset can be set to grind up to 6 microns, with a cut off size of 1 micron. For lapping, the plant processes up to 50 microns in diameter, with a cut off size of 1 micron. The wafers are then polished up to 0.1 microns, with a cut off size of 0.05 microns. SCHNEIDER SLG 120-S2/2 features a closed-loop pressure control model enabling consistent pressure application to the wafers throughout the process. This pressure control equipment consists of a pressure sensor, air supply, and a pressure regulator to ensure consistent and accurate pressure application to the wafer. To improve the accuracy of the pressure, the system also incorporates an independent vacuum unit to help aid in the pressurizing of wafers. Overall, SCHNEIDER SLG 120-S2/2 is a highly effective wafer grinding, lapping and polishing machine that is perfect for demanding precision and accuracy applications. It is fitted with the latest technology to ensure that the process produces consistent and reliable results, even with the most challenging wafers. With its precision grinding wheel, polishing plate, and closed-loop pressure control tool, SCHNEIDER SLG 120-S2/2 is an excellent choice for semiconductor fabrication.