Used SCHNEIDER SLG 120-S2/2 #9296816 for sale

SCHNEIDER SLG 120-S2/2 is a wafer grinding, lapping and polishing equipment designed for majority of materials deposited on large area silicon or non-silicon substrates. This system features a modern automatic blade positioner for high accuracy results as well as a patented IFP technology for fast and precise grinding and lapping cycles. It also provides the ability to combine conventional sharpening and finishing operations in one robust unit. The SLG 120-S2/2 is an automated machine which is capable of processing up to 500 wafers per hour. It features a vertical taper grinding which eliminates the need for additional grinding steps and has a grinding speed up to 200 rpm. Along with providing high-precision grinding, it also offers precise lapping and polishing parameters to achieve precise surface finish. The tool is equipped with a robotic wafer hand-off asset providing safe wafer handling and loading process, as well as automated wafer orientation to ensure precise surface finish results. The model also has an automated setup technique which allows access to various operations without manual re-positioning. This equipment is designed for use in high volume and large area silicon and non-silicon wafer substrates. In addition, the SLG 120-S2/2 has a range of standard features. It has an integrated process controller which records and stores all preset data and parameters for different grinding, lapping or polishing processes. It also includes high-resolution optical microscope which allows for real-time image analysis, as well as precise optical measurement and evaluation of surfaces and edges of samples and work piece. The SLG 120-S2/2 is an advanced wafer grinding, lapping and polishing system, designed and tested to meet the high-precision requirements of the semiconductor industry. It offers automated and precise parameters and control solutions to cater majority of wafer processing needs with high accuracy results, while also offering a safe and reliable wafer handling process.