Used SEEDTEC YSG-1228AHD #170058 for sale

SEEDTEC YSG-1228AHD is a high-precision wafer grinding, lapping and polishing unit. It is designed for the utmost in accuracy and repeatability of wafers for the semiconductor industry. The equipment is built using robust materials to ensure its durability and long-term performance. The system utilizes a high-speed, precision grinding spindle and automated module for rapid material removal. It has an integrated designed air bearing unit to provide smooth operation and high grinding accuracies. The machine includes an adjustable oscillating arm which controls the amount of material being removed by the grinding wheel. This helps to maintain uniformity during polishing operations while minimizing surface damage. A servo-driven polishing turntable allows for automatic control of the rotation and speed, providing enhanced control and accuracy. The YSG-1228AH also includes a sophisticated auto-centering fixture which eliminates the need for manual positioning of the wafer during operation. It further offers a built-in vacuum tool for improved dust control during grinding and polishing operations. The asset utilizes a number of advanced technological features to ensure precision and repeatability. These include variable speed control for the grinding wheel, grinding spindle feed rates as well as variable stroke length for the polishing arm. YSG-1228AHD is designed to be used in conjunction with a number of lapping and polishing compounds, extending its capabilities. It can be used to process various types of wafers. In order to guarantee the maximum accuracy of wafers processed through SEEDTEC YSG-1228AHD, the model includes a number of sophisticated detectors and sensors. These allow the equipment to automatically measure the surface roughness of the actuated parts, ensuring a consistent result each time. Overall, YSG-1228AHD wafer grinding, lapping and polishing system is a highly accurate and repeatable solution for the semiconductor industry. Its robust construction and use of additional technological features make it an excellent choice for a variety of wafer processing needs.