Used SEIKI 4VS #293646287 for sale

SEIKI 4VS
ID: 293646287
Variable speed vertical mill DRO Power feeds.
SEIKI 4VS is an advanced grinding, lapping and polishing equipment that allows for precise production of complex shapes and high accuracy surface finishes. Utilizing the latest in CNC technology, 4VS system is capable of producing precision wafer components for a variety of applications. SEIKI 4VS uses a three-axis CNC tool table unit with programmable grinding and polishing axial depths that allow for producing multiple faces within the same workpiece. This technology also reduces the blades wear while grinding, eliminating the risk of burning as well as reducing the need for manual calibration and maintenance. The specially designed table design coupled with a CNC-driven spindle ensure precision grinding and lapping. The table can accommodate any type of wafer blade form a standard wafer to a specialty form. The spindle can be adjusted to the desired angle to ensure the desired form factor is achieved. The excellent U-channel design minimizes vibration during grinding and lapping processes which ensures a superior finish for the wafers being produced. The machine also provides an encoders and programmable drives to accurately control the grinding and lapping operations. These features ensure that repeatable and precise components are manufactured each time. The grinding and polishing heads are equipped with high-power, high-torque spindle for optimal and high precision grinding, lapping and polishing. 4VS is also equipped with a variety of safety features, such as interlocks and a safety shield, to protect operators from potential harm. This combination of feature ensures that the manufactured components are of the highest quality while keeping the operator safe. Additionally, the tool is designed to be backwards compatible with traditional wafer knives and grinders to allow for easy integration into an existing asset. The combination of efficient CNC technology, superior safety features and easy integration makes SEIKI 4VS the ideal choice for producing high precision wafer components. This model ensures that small batches of large parts can be produced with superior surface finishes and complex shapes, resulting in superior end products.
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