Used SEIKO OFL 12 #127981 for sale

SEIKO OFL 12 is a wafer grinding, lapping, and polishing equipment for use in semiconductor, optical, and other surface preparation applications. The highly efficient system allows users to achieve precise mirror finishes on wafers and components. SEIKO OFNL 12 consists of a grinding station, polishing station, and lapping station. The grinding station uses a specialized diamond wheel to accurately grind wafer surface textures, achieving results that would be impossible to achieve with traditional grinding techniques. The polishing station is designed to produce a high-quality, mirror-like finish on wafer surfaces. The polishing station utilizes a patented unit for precise control over the parameters used in polishing processes. Finally, the lapping station allows for wafer surface finishing and lapping by rotating a flat lapping plate against the surface of the wafer. The lapping technique used in this station is able to produce a very smooth surface and also provide minor corrections to irregular shapes. OFL 12 has a unique operating concept which allows users to quickly and easily change polishing parameters such as speed, pressure, force, and polishing time. The machine is also equipped with several diagnostic features which allow the users to monitor the condition of the grinding and polishing processes. In addition, SEIKO OFL 12 has a safety tool that prevents the wheels from overheating during operation, a feature especially beneficial in high-volume production environments. OFL 12 provides users with a high degree of accuracy and repeatability in wafer grinding, lapping, and polishing processes. It is suitable for various applications in the electronics, optical, and life sciences fields. In addition, the asset is designed to be easily integrated with other equipment, such as CNC machines, making it highly versatile and suitable for use in a wide range of production processes.