Used SEIKO OFL 12 #127985 for sale

SEIKO OFL 12 is a cutting-edge wafer grinding, lapping & polishing equipment. It is designed to achieve high precision machining of wafer thinning, chip size reduction, and polishing. It provides excellent workpiece quality, top-notch repeatability, and dust-free operation in a clean factory environment. The system is equipped with a 12-inch (300 mm) powerful grinding head that is capable of grinding and polishing wafers in one single pass. This minimizes manual handling and provides improved productivity. The grinding head is fitted with a hydrostatic spindle and a custom designed motor that moves the grinding head rapidly and precisely. It also comes with a wide range of abrasive pads to cover all your grinding and lapping requirements. The ultra-accurate alignment unit of OFL 12 eliminates wafer chipping and ensures precise grinding. A high speed precision tip oscillation machine ensures perfect leveling, with no edge deformation. An advanced lapping and polishing tool is also incorporated in the asset, providing a superior finish. The high-performance coolant model helps to reduce the warping & burring of the wafers, and ensures a dust-free polishing environment. Its built-in dust collection equipment also ensures the cleanliness of the entire operation. SEIKO OFL 12 is ergonomically designed for easy operation and maintenance. Its intuitive operator panel and graphical user interface offer unprecedented convenience and control over the work cycle. It also has a built-in diagnostics system that prevents hazardous operation and preserves the accuracy of the finished products. OFL 12 is an ideal wafer grinding, lapping and polishing unit for a variety of industries. It has been designed to deliver high throughput and superior results in mass production of wafers, while maintaining an excellent level of accuracy.