Used SEIKOH GIKEN SFP-510 #119023 for sale

SEIKOH GIKEN SFP-510 is a wafer grinding, lapping, and polishing equipment designed to offer maximum precision, repeatability, and productivity. This system is widely used in the semiconductor industry and is suitable for preparing a wide variety of items including surfaces, substrates, packages, and silicon wafers. The unit is capable of grinding, lapping, and polishing up to eight wafers of a variety of sizes simultaneously. The machine is designed to be user friendly, and allows users to accurately align the abrasives and grinding wheels for each application. The material to be processed is placed onto a platform, where it is securely held during the grinding, lapping, and polishing process. SFP-510 uses advanced grinding and lapping functions to achieve even surfaces. It combines a specially designed grinding stone with a lapping mechanism to provide an extremely smooth, uniform finish. The integrated polishing tool can be adjusted for individual wafer requirements. This helps to reduce unnecessary handling, resulting in a more efficient workflow. SEIKOH GIKEN SFP-510 is also capable of working with a variety of abrasive media to achieve different levels of precision and smoothness. This includes diamond abrasive powder and paper, as well as special resin bond diamond cutting disks. These special disks have been designed to reduce burr formation and provide a long-lasting surface finish. The asset also features an advanced alignment model which ensures accurate and repeatable grinding and polishing of wafers. This eliminates potential errors caused by manual alignment, and helps to improve the overall quality of the finished product. Furthermore, SFP-510 is equipped with a vibration control equipment that ensures a smooth, efficient operation. In summary, SEIKOH GIKEN SFP-510 is an advanced wafer grinding, lapping, and polishing system which offers precision, repeatability, and productivity. It is capable of grinding, lapping, and polishing a variety of items, including surfaces, substrates, packages, and silicon wafers, and is equipped with advanced grinding, lapping, and polishing functions, as well as an advanced alignment unit. In addition, SFP-510 is capable of working with a variety of abrasive media and features a vibration control machine for smoother operation.