Used SEIWA PA-150 MAD #9239628 for sale

SEIWA PA-150 MAD is a wafer grinding, lapping, and polishing equipment designed for high precision and speed. The system is capable of grinding, lapping, and polishing wafers with a vacuum chucking unit. It utilizes an abrasive grinding wheel and diamond lapping discs to create smooth, uniform surfaces. The machine is powered by a servo motor with an adjustable rotating speed of 30 to 150 rpms. It also features a variable feed rate and frequency setting. PA-150 MAD offers up to 5 grinding, lapping, and polishing steps. An optional ultrasonic polishing step is also available. The tool uses a grinding motion to produce a fine surface finish on the workpiece. To achieve the best surface finish, the asset can also use an adjustable lapping unit consisting of two diamond-based discs. The discs work together to remove defects and achieve a high-quality surface. The model is able to easily adjust the speed, pressure, and travel distance when applying the grinding, lapping, and polishing actions. It also features a vacuum equipment which enables the operator to precisely control the pressure applied on the workpiece with a manual or program-controlled process. This process allows for accurate removal of material, while preserving the original surface shape. SEIWA PA-150 MAD has multiple safety features, making it a safe choice for use with hazardous materials. Its safety system includes a cover interlock switch, motor overload protection, guard covers, and dust safety devices. It also has a secondary emergency stop button in case of an unexpected event. PA-150 MAD is a wafer grinding, lapping, and polishing unit that combines high precision, speed, and safety. Its adjustable components, controllable vacuum machine, and automated safety features make it suitable for wafer processing applications.