Used SFM 41323-QG1 #9238648 for sale

SFM 41323-QG1 is a multi-purpose, versatile wafer grinding lapping and polishing equipment designed to meet the most demanding particle size reduction and surface finishing requirements. This system is capable of grinding, lapping and polishing single and multi-layered wafers with abrasive materials. The self-contained single unit can be used for a wide range of wafer grinding, lapping, and polishing processes. The unit's main component is its variable frequency, motor-controlled grinding unit which is precision machined from aerospace grade aluminum. It is designed to have a combined mechanical and electrical stability, excellent thermal insulation, vibration dampening, and environmental protection. The grinding unit features an adjustable positioning device which can be adjusted to meet various grinding and lapping speeds ranging up to speeds of up to 28000 rpm. Its flexible design allows it to handle wafers of various thicknesses and diameters. The grinding/lapping head of the machine has a unique design which maximizes the accuracy of its grinding/lapping process. It is equipped with a variable frequency, motor-controlled drive unit which is able to deliver reliable and consistent performance. In addition, the variable frequency drive tool allows for precise and adjustable speed control. The grinding head is also equipped with a built-in cooling asset and a water-filter to ensure efficient heat management. 41323-QG1 also includes a fully programmable wafer polishing unit. This unit has a touch-control LCD display that allows for easy programming of the robotic wrist and other parameters. The model is capable of providing polishing steps which range from 0.2 to 3.5 microns RMS (Root Mean Square). It can also be used to condition the polishing surface before further lapping. SFM 41323-QG1 is a reliable and robust wafer grinding lapping and polishing equipment with a wide range of applications. It is highly suitable for multilayer wafers, including those of compound semiconductor materials, and its ability to produce highly accurate particle size reduction and surface finishes makes it an ideal choice for both engineering and production purposes.