Used SFT SPP4885 #9390988 for sale

SFT SPP4885 wafer grinding, lapping, and polishing equipment is designed for high efficiency and maximum production yield. This system features a full automated processing sequence with superior wafer handling capabilities. The unit includes an advanced double side grinding (DSG) unit, a multi-function wafer lapping station, and a fully integrated polishing unit. The DSG unit is equipped with two horizontal spindles for simultaneous grinding of both sides of a wafer in one process cycle. This capability allows for rapid and precise grinding of the wafer's surface, achieving a flatness of 4±1 μm on a 2" wafer. The multi-function wafer lapping station features two vertical spindles with the ability to selectively lap one side of the wafer in one operation. This process is designed to produce a uniform finish on the wafer surface without generating any heat. The final operation of the process is performed by the integrated polishing unit. This unit utilizes two process chambers with forced air purification, ensuring a clean working environment and minimizing any potential contamination. State of the art chemical mechanical polishing (CMP) technology is employed to impart a precise surface finish. For best results, the machine is equipped with an optional real-time pressure monitoring tool to ensure optimal polishing conditions throughout the process. SPP4885 wafer grinding, lapping, and polishing asset is designed for maximum efficiency and productivity. Its advanced automated processing sequence is designed to yield superior wafer quality at greatly reduced cycle times. The model is particularly well-suited for manufacturers looking to increase their production yield and enhance the quality of their ceramic and semiconductor substrates.