Used SHARP SG618 #9083403 for sale

SHARP SG618 wafer grinding, lapping and polishing equipment is an advanced and precise wafer-processing system used to create and finish a wide variety of semiconductor wafers. This unit is especially designed for the highest volume production environment with a high degree of accuracy and precision. It uses the latest in wafer grinding, lapping and polishing process technology. SG618 utilizes a horizontal two-axis grinding machine which relies on the precise movement and alignment of the grinding wheel against the wafer surface. This tool produces a uniform, flat and smooth surface which is essential for the fabrication process. It can accommodate wafers ranging from 30mm to 450mm in diameter. The internal positioning axes are equipped with dual linear scales for accurate and repeatable positioning of the grinding wheels. The lapping process utilizes a wet process to polish the wafer surface and the polishing asset consists of a wafer-holding plate and a ribbon drive mechanism which enables precise surface finishing. The adjustable polishing layer thickness can range from 8 to 40µm. The model allows for polishing along the entire wafer surface, making it perfectly smooth and uniform. SHARP SG618 can be configured with a range of grinding wheel types and lapping films, depending upon the desired surface finish and wafer types being processed. Furthermore, it is equipped with safety features that protect it from damage due to overload or grinding pressure. SG618 is a versatile, advanced wafer-processing equipment that offers high levels of speed, accuracy, precision, and repeatability. The system is suitable for the most demanding and complex wafer manufacturing operations and is an ideal partner for achieving the best possible surface quality.