Used SHENG TECHNOLOGY GTC-085 MK6 #293647906 for sale

SHENG TECHNOLOGY GTC-085 MK6
ID: 293647906
Slicers.
SHENG TECHNOLOGY GTC-085 MK6 is a wafer grinding, lapping and polishing equipment for advanced lapping, grinding, and polishing of wafer-based substrates. This powerful system provides controlled grinding, lapping and polishing processes to produce substrates with flat, smooth surfaces. It features a high-quality electronic speed controller with easy access to low- and high-speed settings. The unit also boasts an independently programmable grinding force controller, allowing operators to achieve sophisticated wafer grinding and etching parameters with ease. Additionally, it provides an audio signal machine which allows operators to quickly assess the grinding and lapping process by hearing the sound of the grinding tools. GTC-085 MK6 is designed to minimize time, labor and material costs while maximizing accuracy and performance. This tool is powered by a variable speed drive motor, providing a variable grinding and lapping speed range of 0-5,000 RPM. In addition, this asset utilizes a precision grinding mechanism which allows for precisely controlled grinding and lapping motions in each axis. It also has powerful dust collection capabilities, which ensure a clean and safe working environment. Moreover, SHENG TECHNOLOGY GTC-085 MK6 is equipped with an integrated auto-stop feature which activates automatically when the grinding process is complete. This feature helps operators save time during wafer grinding and lapping processes by eliminating the need to manually stop the grinding and lapping process. Additionally, it also has a pressure-sensing arm, which automatically adjusts the grinding pressure depending on the surface of the substrate that is being processed. This ensures uniform results in each cycle. GTC-085 MK6 is the ideal solution for advanced wafer grinding, lapping and polishing processes. Its powerful features allow operators to efficiently achieve results of the highest accuracy and quality, while also saving time and labor. Furthermore, its operation is cost-effective and user-friendly, allowing operators to easily set-up and process wafers with great precision and reliability.
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