Used SHENG TECHNOLOGY GTC-085 #293647907 for sale

SHENG TECHNOLOGY GTC-085 is a multi-functional wafer grinding, lapping and polishing (GTLP) equipment specifically designed for semiconductor fabrication. The system has been engineered to process 200mm, 300mm, and 450mm diameter wafers in all stages of production, from initial slicing and edge grinding to post-process polishing after thinning. GTC-085 unit integrates advanced technologies to deliver optimized precision particle grinding and polishing. The machine utilizes two vacuum chambers for processing multiple wafers simultaneously, and each wafer can be loaded and unloaded independently. The wafer grinding, lapping and polishing processes are highly automated for consistent performance and reproducible results. The tool features an embedded controller with a touch-screen interface to quickly and easily program and monitor process parameters. The user can select from a variety of process settings and recipes, as well as set lapping and polishing speeds and times. The asset also includes an integrated software package with a graphical user interface (GUI) for tracking and recording production runs. The grinding mechanics of SHENG TECHNOLOGY GTC-085 model are capable of delivering nano-scale precision particle grinding and polishing. The equipment also has a high grinding throughput, allowing for long process times as well as large wafer sizes. Additionally, the two-stage vacuum chamber reduces particle contamination during processing, and the integrated software package is designed to capture real-time process information for comprehensive traceability. Overall, GTC-085 is a high-precision, automated wafer grinding, lapping and polishing system specifically designed for process-controlled semiconductor fabrication. With its easy-to-use interface, rapid throughput, and advanced technologies, SHENG TECHNOLOGY GTC-085 is an ideal solution for ensuring optimal wafer surface finish and characteristics.