Used SHENG TECHNOLOGY GTC-107021 #293647874 for sale

SHENG TECHNOLOGY GTC-107021 is an automated wafer grinding, lapping and polishing equipment that produces extremely flat, uniform, and defect-free surfaces on wafers and semiconductor substrates. This system is suitable for different types of materials, such as Silicon (Si), Silicon Carbide (SiC), and Gallium Arsenide (GaAs). GTC-107021 features two stages of wafer grinding, lapping, and polishing process. In the first stage, the unit uses fixed-abrasive grinding to quickly and accurately reduce surface roughness. This machine is equipped with diamond grinding wheels and automatically controls the necessary grinding parameters to create the desired surface texture and quality. The second stage polishing process uses loose-abrasive slurries of diamond or abrasive particles to achieve very high levels of planarization and surface finish. The tool can also detect and track surface defects in order to characterise surface quality. The asset's robotic loading enables wafers of varying sizes and thicknesses to be easily loaded and unloaded. The process can be monitored through a human-machine interface, and remote monitoring and control of the model are readily accessible via Ethernet or Serial connection. Process recipes as well as all records of operations are stored for easy retrieval and analysis. The machine tools are also temperature and humidity controlled, and the coolant equipment helps to keep the diamond wheels and slurries from overheating. SHENG TECHNOLOGY GTC-107021 provides a reliable and cost-effective wafer grinding and polishing solution, achieving repeatable results with very low surface roughness, high uniformity and defect-free performance in accordance with standards. The system is suitable for a wide range of semiconductor processes, including front-side and back-side lapping and polishing, production of semiconductor wafers and substrates, and inspection of surface topography. The unit can achieve extremely flat, defect-free and uniform surfaces for a variety of applications, including solar cell substrates and MEMS.