Used SHENG TECHNOLOGY GTC-107057 #293647876 for sale

SHENG TECHNOLOGY GTC-107057 is a wafer grinding, lapping and polishing equipment designed to facilitate precise, accurate and high speed processing of wafers. The system is composed of a multi-stage process line which allows continuous automatic process control. This unit is designed to improve the quality of grinding, lapping and polishing for any type of wafer. The autoloading machine offered with GTC-107057 has a tray loading unit and pre-aligner which ensures that wafers are loaded into the process line in the most secure way. It can also be used to relieve manual labor and improve the efficiency of processing. The tool has a turntable with servo drive that provides the precise external speed control. This turntable is an important part of the process asset as it provides lapping, grinding and polishing on the same plane. Grinding of the wafers is accomplished with the high speed spindle model. This is designed to rapidly reduce the thickness of the wafer and provide a smooth inner surface. The workpiece is moved under the abrasive grinding head in order to ensure the most accurate production of the wafer. The lapping equipment of SHENG TECHNOLOGY GTC-107057 includes a series of controlled abrasion steps. These steps are performed to prepare the surface for polishing. This process increases the surface quality of the wafers by eliminating surface roughness, making the wafer smoother and flatter. The final stage of the process is the polishing of the wafer. This polishing is done using a polishing brush, slurry and a series of polishing pads. The brush, slurry and pads are used to remove any residual roughness or impurities from the surface of the wafer providing a high quality finish. GTC-107057 is a highly advanced system designed to improve the accuracy and efficiency of grinding, lapping, and polishing of wafers. The automatic loading unit, turntable and high speed spindle ensure precise production and production of high quality wafers. The controlled abrasion steps of the lapping machine ensure surface quality and the use of brushes, slurry and polishing pads provide a high quality finish.