Used SHENG TECHNOLOGY GTC-107061 #293647889 for sale

SHENG TECHNOLOGY GTC-107061 is a wafer grinding, lapping, & polishing equipment that is primarily used to process multi-layered electronic and optical materials. The system is capable of processing 6, 8, 10, &12-inch wafers with a thickness ranging from 0.15mm to 7.5mm. The grinding process utilizes a 5-axis CNC grinder along with diamond grinding stones to produce a micro-chip finish on the wafer surface. The lapping process is completed using an automated toolhead to lap the wafer at a uniform velocity. This process is necessary for wafers that necessitates a higher surface finish or higher level of flatness. The final polishing step utilizes small diamond particles to create a mirror-like finish on the wafer. The unit is designed for full automation to streamline production & improve repeatability and accuracy. It features an intuitive control interface and is equipped with multiple process sensors to continuously monitor process conditions. It utilizes a robot end effector to fasten and release the substrate. The machine is also equipped with safety sensors to immediately stop operations if an operating anomaly is sensed. GTC-107061 offers high-precision three-dimensional machining capabilities with a maximum process accuracy of 0.5µm. It is reliable and its modular design allows for process flexibility and easy maintenance. It is equipped with industrial auto-diallers that generate real-time process data. SHENG TECHNOLOGY GTC-107061 is suitable for use in research and development applications, small-scale production of device components, and micro-electronics. It meets the industry standards for safety, performance, and quality manufacturing. This tool is ideal for those looking for a robust and precise wafer grinding, lapping, & polishing solution.