Used SHENG TECHNOLOGY GTC-107155 #293647904 for sale

The SHEENG TECHNOLOGY SHENG TECHNOLOGY GTC-107155 wafer grinding, lapping & polishing equipment is an advanced precision engineering tool used for simultaneously grinding and polishing multiple substrates. It utilizes a combination of mechanical and electrochemical methods for grinding, lapping, and polishing of substrates, with the ability to grind diamonds, semiconductors, silicon, and other materials. The system is designed to deliver high accuracy and repeatability, while providing a robust and ergonomic working environment. At its core, GTC-107155 utilizes an electrically adjustable chuck which allows for precise material control and positioning. This enables the uniformity and repeatability of the grinding/polishing process to be consistently maintained. Its optional asynchronous controller gantry operates on 3 axes (X, Y, and Z) to ensure precise and accurate movement of the substrate over the chuck. The chuck can swivel both horizontally and vertically, allowing for increased process flexibility. The unit is equipped with an integrated grinding wheel that can be precisely adjusted to accommodate the desired results: from coarse to smooth, from flat to curved surfaces, from lapping to polishing operations. It is capable of grinding up to 8 inch substrates at a time with a maximum feed rate of 2" per minute. It is powered by a 3/4 hp DC motor for efficient and powerful grinding action. Additionally, it is built with an electric coolant machine that can be controlled to manage heat buildup during long grinding processes. SHENG TECHNOLOGY GTC-107155 has a set of precise metrology tools built in for quality assurance and monitoring, including an optical profilometer and a variety of precision sensors. These features help to ensure that a precise and accurate surface finish is achieved during each cycle of operation. The tool also comes equipped with a variety of advanced safety features to minimize operator injury when running the machine. In summary, the SHEENG TECHNOLOGY GTC-107155 wafer grinding, lapping & polishing asset is a highly advanced engineering tool, combining precision machining, lapping and polishing capabilities in a single piece of equipment. Its robust motor and adjustable chuck assembly provide an effective and efficient way to grind and polish a variety of substrates, while its integrated metrology tools and safety features ensure accurate and consistent results in a safe working environment.