Used SHIGIYA G-30ND #9180185 for sale
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ID: 9180185
Vintage: 2008
CNC Cylindrical grinding machine
Fanuc CNC control
Diameter drill grinder
Maximum working diameter:
Whetstone (405 mm): 300 mm
Whetstone (510 mm): 255 mm
Maximum working weight: 130 mm
Standard whetstone width: 25 - 75 mm
2008 vintage.
SHIGIYA G-30ND is an innovative and advanced grinding, lapping and polishing equipment. This system is capable of producing highly-accurate surfaces with a polished finish. It utilizes a three-axis movement that allows for precise and efficient grinding of a wide range of materials such as ceramics, metals, and plastics. G-30ND is equipped with a user-friendly graphical display and intuitive controls, allowing for easy operation and fast setup. This reduces downtime and increases productivity, providing a cost-effective means of producing high-precision wafers. It also offers superior granite and guideway unit which provides stability, ensuring the highest levels of accuracy. The grinding unit can accommodate up to eight 300mm diameter wafers, allowing for increased throughput and reducing lead-times. Optional spindle attachments are also available, enabling the machine to handle different materials. A high-power spindle motor provides reliable and consistent grinding performance. The grinding process begins with a cold-state grinding procedure wherein the fine abrasive particles are gently applied by the spindle. This is followed by a lapping step wherein the wafers are smoothly brushed to create a perfectly flat surface. Finally, a polishing step is used to produce a clean and glossy finish. SHIGIYA G-30ND has an advanced safety feature wherein the grinding and polishing process will automatically stop when any unexpected noise or vibrations are detected. It also features a coolant tool that not only adds to productivity, but also ensures the machine is kept clean and dust free. G-30ND is an ideal solution for those looking to have high-precision wafers for their research and development projects or high-volume production needs. This grinding, lapping and polishing asset is a robust and reliable machine, capable of producing high-quality wafers with a perfect finish, in a safe and effective manner.
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