Used SHIGIYA GP-30B.60A #9395054 for sale

SHIGIYA GP-30B.60A is a versatile wafer grinding, lapping & polishing equipment that provides a highly efficient and accurate solution for the processing of large quantities of ultra-thin semiconductor wafers. This system is designed to accommodate up to four wafers, being 30 mm or less in diameter. The GP-30B.60A features a fully integrated grinding, lapping and polishing unit, allowing full control over the entire process. This includes a stationary hopper for grinding, lapping, and polishing disks, as well as a collimator with a viewing window that can be adjusted in size to fit the wafers being processed. In addition, the machine features a vertical precision chuck for attaching the wafers to the grinding, lapping, and polishing disks. The grinding, lapping and polishing processes are driven by adjustable motors, as well as variable speed settings for each grinding, lapping and polishing process. This allows the user to precisely control the surface finish on the wafer. Furthermore, the grinding, lapping and polishing process is automated through a programmable controller and embedded software that provide an easy to use interface. The GP-30B.60A includes an entire suite of safety features, including a keypad lockout tool and safety sheet covering the entire asset to prevent accidental contact with moving parts. Additionally, the model is designed with shieldings designed to protect the operator from any hazardous particles that may be created during the grinding, lapping and polishing processes. This equipment also features a range of advanced features to further enhance its performance, including a rotational alignment wheel for adjusting the position of the wafer and a rotating stage for selecting the desired position of the grinding, lapping and polishing disks. Finally, it is designed for easy maintenance and cleaning, allowing for quick and efficient reconfiguration of the system if required. SHIGIYA GP-30B.60A wafer grinding, lapping & polishing unit is designed to maximize throughput while maintaining precise control over the entire grinding, lapping and polishing process. This machine is ideal for achieving ultra-thin, high-precision semiconductor wafer processing. It is a reliable and dependable tool that is sure to meet the needs of any production environment.