Used SHIMADZU DUH 211S #9388336 for sale

SHIMADZU DUH 211S is a multipurpose wafer grinding, lapping and polishing equipment that is ideal for a wide range of applications including semiconductor production, wherein tight process requirements such as low compression force, highly accurate surface finish, low leakage current, and thermal stability of the device are demanded. It is outfitted with an array of features that are designed to ensure precise control and optimization of grinding, lapping, and polishing processes, making it suitable for both pre-processing and post-processing applications. It utilizes a combination of rigorous mechanical and chemical resources, including a robust oscillating grinding head, an aggressive lapping head, and a fine polishing anode, to deliver perfectly prepared surfaces for device fabrication. DUH 211S offers independent control of X, Y and Z axes, allowing it to easily accommodate a variety of wafer shapes and sizes. It also features a high-precision, low-friction, direct-drive spindle system that ensures maximum precision and process control. In addition, the unit offers a dual-stage cooling machine that helps ensure efficient operation and helps to reduce thermal process disturbances, as well as an array of digital communication capabilities. The tool also features a variety of user-friendly features that help simplify operation and process validation. These features include an intuitive user interface complete with touch-screen controls and a variety of preset parameter settings, as well as advanced process monitoring and data collection tools that enable operators to quickly evaluate and refine methods. When quality-critical tasks are required, SHIMADZU DUH 211S offers unbeatable performance and reliability. With its precise control of grinding, lapping and polishing processes, the user can reliably achieve superior uniformity and accuracy of surface finish. The asset is equipped with all the necessary tools needed to help operators take advantage of its tremendous processing power, helping to make it an ideal choice for a wide variety of wafer fabrication requirements.