Used SHIMADZU HMV-2 #293824207 for sale

SHIMADZU HMV-2 is a multi-head processing equipment featuring a large-capacity, two-spindle grinding/lapping and polishing unit. This grinding/polishing system offers precise and accurate results for a variety of lapping, grinding, and polishing process requirements. The unit features two main components - the main grinding/polishing spindle and the lapping/polishing spindle. The main grinding/polishing spindle is powerful and can process samples at speeds of up to 10,000 rpm. The second spindle is designed for lapping and polishing processes and can reach a speed of up to 24,000 rpm. The unit also offers a 10-slot slide-in chuck for holding nanoparticles and wafers during the processing. HMV-2 offers advanced electro-magnetic drive technology, low-vibration performance, and excellent temperature stability. It also includes a variety of grinding/polishing accessories, a PLC controller, a high-accuracy digital display, ergonomic design, and simple manual operation for efficient and safe usage. The unit is ISO-9001 certified, featuring metallurgical analysis tools, including an Air Microscope, Atomic Absorption Spectrometer (AAS), and a Surface roughness test. It also features a wide range of advanced electro-magnetic drive technology with smooth, continuous operation and low vibration. SHIMADZU HMV-2 is an efficient and versatile unit, ideal for tedious grinding and polishing tasks, particularly of delicate and difficult to manipulate components, such as thin wafers and nanoparticles. Furthermore, its extreme accuracy and high-precision polishing capabilities, make the machine the ideal choice for various surface processing needs, making it a great choice for both laboratory and industrial applications.