Used SHIMADZU HMV-2000 #293657210 for sale

SHIMADZU HMV-2000 is a precision grinding, lapping, and polishing equipment designed for maximum efficiency and accuracy in manufacturing and finishing procedures. With a range of standard processes and the ability to be easily adapted to suit specific requirements, HMV-2000 offers the flexibility to meet the demands of a broad range of applications. SHIMADZU HMV-2000 features a large grinding chamber for accommodating up to 18" wafers. This chamber also contains two independent grinding plates for optimal processing evenness and speed. In addition, the grinding plates can be quickly changed to avoid frequent sharpening operations. The base of the system is composed of a solid frame, while the upper part is automotive-grade aluminum. A vacuum sealing unit ensures tightness in the grinding chamber, enabling a larger wafer grinding circle. The machine also allows for precision polishing, lapping, edge grinding, and squaring of wafers. An integral spindle motor supplies precise grinding power across a broad range of set RPM values. For complex and precise operations, an adjustable dressing tool is available which permits automatic fine-tuning of grinding wheel parameters. HMV-2000 is designed to provide repeatable, accurate, and uniform results regardless of wafer material or size. This is achieved by a direct drive asset and a closed loop digital-speed control, providing smooth and consistent goal operations at all times. With its built-in drive control, the model also offers improved process reliability, eliminates potential process drifts over time, and reduces maintenance requirements. SHIMADZU HMV-2000 is controllable via PC through an integrated wafer data acquisition equipment, enabling operators to monitor and control the grinding process. This allows process parameters to be adjusted in real time and utilizes optimized statistical process control (SPC) to guarantee consistent product quality. Furthermore, the system is capable of saving process recipes for use in future wafer operations. HMV-2000 offers an all-in-one precision grinding, lapping, and polishing unit that is ideal for a wide range of applications in the semiconductor industry. With its intuitive design, powerful drive machine, and control capabilities, SHIMADZU HMV-2000 is an ideal choice for those in search of a reliable and efficient wafer grinding and finishing tool.