Used SHIN OHTSUKA SK-07-6328-2 #9314587 for sale

SHIN OHTSUKA SK-07-6328-2 is an automated semiconductor wafer grinding, lapping and polishing equipment designed for use in manufacturing integrated circuits (ICs). This system offers a comprehensive set of tools and features to achieve the desired level of high-precision soft and hard grinding, lapping and polishing of semiconductor material. SK-07-6328-2 is composed of a two-stage grinding apparatus with high-precision air bearing spindles and a control unit. The feed rate and the spindle speed of the grinding apparatus can be accurately adjusted. The total weight of the unit is approximately 63kg (140lbs). The grinding spindles are equipped with a specially designed wafer-adhesive chuck that enables the holding of oversized wafers as well as thin wafers with a minimum warp distortion. In this way, the machine can process a variety of wafer types in a single solution. For increasing the being processed rate, the wafer can be transported sidewise and automatically exchanged to the different grinding spindles. The machine is also equipped with a coolant filtration tool for preventing foreign bodies and dust to pass to the wafers. SHIN OHTSUKA SK-07-6328-2 is further equipped with a lapping process that increases the surface quality of semiconductor wafers by generating less surface roughness. It is also capable of polishing hard and soft materials that are typically used in ICs. Furthermore, this asset features a number of safety and safeguards features to protect the operator from hazardous operations. It includes an anti-slam shut protection and a high-speed shut-off, as well as automatic transfer of the wafers to the next process. Overall, SK-07-6328-2 is an automated, versatile, and reliable turnkey model for precise grinding, lapping, and polishing of semiconductor wafers. It is designed for meeting the highest requirements in terms of productivity, precision and cost-efficiency.