Used SHINKO SGR-700 SP #9259503 for sale

SHINKO SGR-700 SP is a high performance wafer grinding, lapping & polishing equipment. This system provides a complete production process from pre-grinding, lapping and polishing of thin wafers. The exceptional grinding and polishing capabilities of the unit are capable of fabricating superior quality substrates required for the production of advanced devices. The machine is designed to allow easy maintenance with minimal downtime and minimal operator intervention. The high-performance roller mechanism utilizes two abrasive rollers for fast stock removal and improved lapping/polishing results. The roller mechanism is protected from abrasion and corrosion by a special coating on the surface of the roller. The roller also rotates at high speed to optimize grinding/ lapping/polishing of the substrate. The highly efficient lapping and polishing stage of the tool utilizes free-abrasive polishing technologies to control particle size, shape and size distribution. The free- abrasive polishing technology offers great surface quality, superior surface finish and uniformity. This ensures consistent results from substrate to substrate. SGR-700 SP also features semi-automated front-end operations such as quick loading and unloading, automated gap adjustment and self-tracking of grinding/lapping/polishing speeds. SHINKO also utilizes frictionless grinding with precise and consistent grit size distribution over the whole wafer surface. This increases throughput, reduces dust and improves the finished wafer. SHINKO SGR-700 SP is CE certified and ISO Certified one- stop process for wafer grinding, lapping and polishing. The asset is suitable for the mass production of ICs, MEMS and other semiconductor wafers. SGR-700 SP is designed for high-accuracy production, flexibility, reliability and durability. It is the ideal choice for a one-stop solution for wafer fabrication.