Used SHINKO SKS-250 #9259495 for sale

SHINKO SKS-250 wafer grinding, lapping, and polishing equipment is an ideal choice for grinding and polishing small and medium size semiconductor wafers. It is designed to ensure high precision while providing efficient operation. This system is a single piece of equipment that can handle various grinding and polishing operations. The unit is composed of a grinding and lapping unit, a polishing unit, and a vacuum machine. The grinding and lapping unit makes use of a diamond grinding wheel and a polishing stone to precisely grind and lap the surface of the wafer. The polishing unit makes use of polishing pads and a polishing stone to produce a smooth, uniform surface on the wafer. The vacuum tool ensures the wafers are held securely during processing. The asset is fitted with an integrated microprocessor-controlled operation mode selector, allowing users to choose between different operating modes, such as manual, semi-automatic, and automatic. Furthermore, it comes with a digital touch screen display for easy operation. This model can handle 180mm (8 inches in diameter) wafers. It features a very low noise level and vibration, making it ideal for grinding and polishing in clean rooms. Furthermore, this equipment comes with numerous safety features to ensure user safety, including pressure switches, interlock monitoring, and programmable limit switch functions. It also features automatic self-diagnoses capabilities, ensuring optimal performance and accuracy. The system is very simple to operate, can be easily maintained, and requires very limited operator involvement. All in all, SKS-250 wafer grinding, lapping, and polishing unit is a reliable and powerful tool for the grinding and polishing of semiconductor wafers. With its digital touch screen display, pressure switches, interlock monitoring, and other safety features, it is easy to operate and highly efficient. In addition, this machine provides very high precision and quality results while ensuring user safety and requires minimal operator involvement.