Used SHINKO SKS-300 #9269780 for sale

SHINKO SKS-300 is a state-of-the-art wafer grinding, lapping and polishing equipment. It is designed to grind, lap and polish wafer substrates with precision and accuracy. This system is suitable for applications that require nano-surface processing and ultra-thin wafers. The core of the unit is the grinding head, which is driven by an AC servo motor giving the machine precise and accurate control for grinding, lapping and polishing of variously-sized wafer substrates. This allows for high throughput of production. The tool is equipped with an 18-inch full color touch display with user-friendly menu that makes grinding, lapping and polishing jobs easy to operate and manage. The user can select from a variety of grinding modes such as constant, step, and linear profile grinding. The grinding head spindle is capable of speeds up to 10,000 rpm and allows for precise adjustment of grinding spindle traverse. The lapping table of SKS-300 is designed with a cross linkage mechanism that provides uniform and consistent loading of the material and the spindle. This ensures precise and repeatable results across the entire wafer. It also ensures uniform and consistent loading of the wafer material. The asset is equipped with a dual polishing head. This enables two polishing operations to be completed at the same time. The adjustable gap allows for choice of diamond sizes and shapes for precisely-tuning the polishing performance. In addition to the grinding, lapping and polishing operations, SHINKO SKS-300 has a vacuum wafer chucking mechanism that securely holds wafer substrates in place during the grinding and polishing processes. SKS-300 wafer grinding, lapping and polishing model features precise and quick control of the grinding and polishing processes, as well as precise versatile control over the grinding and polishing methods. This makes it ideal for applications requiring high accuracy and throughput for nano-surface processing of variously-sized wafer substrates.