Used SHONAN BZ-WF-802SU #9378346 for sale

SHONAN BZ-WF-802SU is a highly advanced wafer grinding, lapping, and polishing equipment. It features an advanced operating system with a touch-screen that allows for quick and easy navigation, and monitoring. The unit uses specially designed diamond-tipped blades in order to accurately cut through the wafer, with no damage to the crucial structures of the material. The grinding process produces a surface with an extremely high roughness, allowing for a superior, ultra-precise crystal polishing. The machine utilizes advanced technologies such as a programmable speed controller and cutting head that facilitate adjustments to the grinding and polishing requirements. This ensures that the desired results are achieved every time. The tool also incorporates a high-precision lapping device that smoothes out the surface of the material to create a uniformly flat and perfectly round wafer. The wafer is further polished using diamond-tipped lapping plates which ensure that the final product is precise and of the highest quality. The machine also has the ability to process a variety of materials, including Si and Si-based materials. It also offers advanced measuring tools for evaluating the wafer's properties and performance. This includes an optical microscope and other instruments that are used to examine the wafer's surface roughness, flatness, and roundness. BZ-WF-802SU is one of the most advanced systems on the market for wafer grinding, lapping, and polishing. Its advanced features allow it to quickly and accurately produce flawless wafers with superior performance. The asset is also easy to operate, making it ideal for a wide range of industries and application environments.